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A £9m R&D project in Scotland aims to boost the UK's semiconductor packaging capabilities, enhancing manufacturing efficiency.
A new £9m R&D project to increase the UK's semiconductor packaging capability has been unveiled, marking a major move to reshore a critical element of the nation's electrification supply chain. The facility, being hosted by the National Manufacturing Institute Scotland (NMIS) and funded by Innovate UK, will open in 2025 in Inchinnan, Renfrewshire, as part of the University of Strathclyde's Advanced Net Zero Innovation Centre (ANZIC).
The factory will feature an advanced semiconductor packaging scale-up line, the first of its kind in Europe, to accelerate the production of power electronic semiconductors. The technology will make semiconductor packaging time less because it will dramatically reduce it from months to just days. Since semiconductor devices are vital in products like renewable energy systems, high-end computing, wireless communications, and the automotive industry, the breakthrough will have wide-ranging effects on the UK manufacturing industry.
Semiconductors are becoming even more crucial to net-zero objectives, yet the UK has lapsed behind due to global materials shortages and lack of domestic manufacture capacity. The new NMIS centre will permit UK companies to take the forefront in innovative resolutions and increase usage of domestically manufactured semiconductor materials. Not only will it plug gaps in production, but it will fuel growth in the UK semiconductor packaging market, which is worth £750m by 2030.
The scheme will bring together world-leading experts in NMIS, the Compound Semiconductor Applications (CSA) Catapult, and the High Value Manufacturing (HVM) Catapult to support manufacturers in achieving higher productivity and efficiency. The scheme will almost certainly establish Scotland as a top-ranked advanced manufacturing hub globally, driving innovation and releasing new opportunities for businesses worth high value.
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