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IBM and SCREEN Partner on Advanced Cleaning for Next-Gen EUV

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Business Honor - IBM, SCREEN Advance EUV Cleaning

Business Honor
25 September, 2025

IBM and SCREEN joins together to develop cleaning tech for future semiconductor EUV lithography

A new partnership between IBM and SCREEN Semiconductor Solutions Co., Ltd. aims to provide the latest cleaning solutions for Extreme Ultraviolet (EUV) lithography in the future. This partnership expands on their prior successful interactions that facilitated the production of the most recent nanosheet devices.

EUV lithography's application is growing quickly as semiconductor manufacturing keeps reducing device sizes. High Numerical Aperture (High NA) EUV technology in particular is thought to be a significant development for moving past the 2nm production node. Even little particles or surface flaws that were previously thought to be minor now present higher hazards to the quality of wafer patterning in these advanced methods. Because of this, creating extremely efficient cleaning methods is essential.

IBM and SCREEN, a company that specializes in precision wafer cleaning equipment, will collaborate under the new partnership, utilizing IBM's extensive experience in semiconductor process integration. When combined, they seek to meet the demanding specifications of High NA EUV lithography. General Manager of IBM Semiconductors and Vice President of Hybrid Cloud at IBM, Mukesh Khare, emphasized the significance of this technology in developing more compact and potent chips that facilitate the expanding artificial intelligence space. He expressed interest about strengthening IBM’s partnership with SCREEN to speed up revolution and provide dependable solutions for both IBM and its ecosystem partners.

Akihiko Okamoto, President of SCREEN Semiconductor Solutions, shared as noting that combining IBM’s deep development expertise with SCREEN’s advanced cleaning technology would support the production of reliable sub-2nm chips. The joint effort aims to advance cleaning processes that improve chip performance and yield, while helping manufacturers address the challenges of next-generation semiconductor fabrication.