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Tongxin Microelectronics Unveils Payment Solutions at Seamless Middle East Fintech 2025

Fintech and Financial Services

Business Honor
21 May, 2025

Tongxin Microelectronics is changing global payment technologies with its advanced secure chips and eSIM solutions.

Tongxin Microelectronics (TMC), one of the world's leading suppliers of high-speed security chips and solutions, will introduce its latest innovations in payment technologies at Seamless Middle East Fintech 2025 from May 20-22 at Dubai World Trade Centre. The event is expected to attract players from across the global payments economy as TMC showcases its next-generation security chip technologies for payment IC cards and payment terminals.

Global payment networks like UnionPay, VISA, MasterCard, American Express, JCB, and Discover have embraced Tongxin Micro's security chips, which are certified to international standards like EMVCo and CC EAL6+, for the payment IC card market. These chips are implemented in more than 100 countries and regions, providing safe, smooth payments globally.

For payment terminals, TMC's secure microcontroller units (MCUs) qualify for high standards such as PCI 7.x and UPTS 3.0, perfect for smart POS/mPOS systems and other secure payment terminals. The chips provide higher processing performance, extremely low power consumption, and wide ecosystem support, which has facilitated high-volume commercial deployment in global financial markets.

The highlight of this event will be the MIS integrated terminal platform, which Tongxin Micro developed on its secure MCU. The one-stop terminal is equipped with NFC and QR code scanning, allowing for quicker and more convenient transactions for leading payment brands such as VISA and MasterCard.

Meeting the increasing demand for compact, multi-networked POS hardware, Tongxin Micro will introduce the world's first eSIM solution aimed at smart POS devices. This innovative technology makes physical SIM cards unnecessary and ensures smooth global connectivity for mobile plug-and-play payment terminals.

With more than 24 years of experience in secure chip R&D, Tongxin Micro is well-positioned to define the future of fintech and financial services, continuing to make the global payments landscape even more sophisticated.