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IBM Partners with Deca to Advance Chiplet Packaging in Bromont Facility

IBM

Business Honor
22 May, 2025

IBM and Deca team up to expand advanced chip packaging using M-Series technology.

In order to add Deca Technologies' advanced M-SeriesTM and Adaptive Patterning® technologies into its semiconductor packaging plant in Bromont, Quebec, IBM has announced a new partnership with Deca Technologies. As part of the deal, IBM will set up a high-volume production line using Deca’s M-Series Fan-out Interposer Technology (MFIT™), a solution designed to improve how chip components are connected in advanced devices.

This partnership supports IBM’s goal to strengthen its advanced packaging capabilities. The Bromont facility is one of the largest testing facility and semiconductor assembly in North America. This facility has been at the leading position for packaging invention for more than 50 years. With recent upgrades, the site is now even more prepared to support new technologies for artificial intelligence (AI), high-performance computing (HPC), and data analytic centers areas where MFIT plays a key role.

Deca’s M-Series is already the most widely used fan-out packaging platform, with over seven billion units shipped worldwide. MFIT takes this further by using fixed bridge die to create strong, efficient connections between chiplets smaller chip parts that work together. This method is faster and more flexible than traditional silicon interposers by helping in the support of the growing demand for complex chips in AI and HPC.

The partnership highlights a shared vision between IBM and Deca to lead in the next generation of chip design and manufacturing. By combining Deca's technology with IBM's established packaging capabilities, the two companies are helping to grow the worldwide supply chain for contemporary computing goods.

IBM’s Scott Sikorski said that this move will help the Bromont facility stay ahead in chiplet and packaging innovation, making it easier for IBM’s clients to create faster, more powerful AI and data solutions. Deca’s CEO, Tim Olson, called IBM the perfect partner to bring MFIT to large-scale production in North America.